Key Features
- High-quality aluminum heat spreader
- DDR4 memory standard for enhanced performance
- Intel XMP 2.0 ready
- Limited lifetime warranty
Built for High-Performance
The H-ONE memory is designed for gamers to achieve optimal stability for a superior gaming experience. Each PCB board has been through strict series of tests to ensure compatibility with the majority of motherboards on the market.
![](https://thermaltake.azureedge.net/pub/media/wysiwyg/key3/db/products/Memory/h_one/pic1.png)
![](https://thermaltake.azureedge.net/pub/media/wysiwyg/key3/db/products/Memory/h_one/pic1_1.png)
Aluminum Heat Spreader with Distinct Style
Incorporating sleek lines and geometric cut edges, the aluminum heat spreader of the H-ONE reveals a truly unique style.
![](https://thermaltake.azureedge.net/pub/media/wysiwyg/key3/db/products/Memory/h_one/pic3.png)
DDR4 Memory Standard for Enhanced Performance
DDR4 memory standard designed, the H-ONE memory effectively lowers power consumption and enhances overall computing performance.
Enhance Performance & Bandwidth
Lower Power
Consumption
![](https://thermaltake.azureedge.net/pub/media/wysiwyg/key3/db/products/Memory/h_one/pic6.png)
Intel XMP 2.0 Ready
Overlock with ease and optimize system stability with a simple setting.
![](https://thermaltake.azureedge.net/pub/media/wysiwyg/key3/db/products/Memory/h_one/pic5.png)
P/N | R021D416GX1-3200C22D |
---|---|
RODZAJ PAMIĘCI | DDR4 |
POJEMNOŚĆ | 16GB (1x16G8 ) |
TESTOWANE OPÓŹNIENIE | 22-22-22-52 |
NAPIĘCIE (V) | 1.2 V |
Speed | 3200 MHz |
ZGODNOŚĆ | Intel 500,400,300 Series AMD X570, B550 |
Rodzaj modułu | DIMM |
PROFIL WYDAJNOŚCI | XMP 2.0 Ready |
Zawartość opakowania | 1 x 16GB memory module |
Gwarancja | Limited Lifetime Warranty |